Products
NWD281L-Fully Automatic Wafer Temporary Debonder

4”-8”wafer application
Thinner wafer capability
Wafer cassette loading & unloading
Automatic bonded wafer aligning
Thermal debonding device wafer & support wafer
Used bonding tape robot peeling
Automatic wafer mounting
Wafer intelligent mapping in cassette
Built-in LED UV irradiating module (Optional)
PC based control with Windows OS
SECS/GEM or simple communication